4-aluminum nitride powder is used for manufacturing high-performance ceramic devices. Manufacturing integrated circuit boards, electronic devices, optical devices, heat sinks, high-temperature crucibles.
2. Aluminum nitride substrates are ideal heat dissipation and packaging materials for LED lighting, large-scale integrated circuits, semiconductor module circuits and high-power devices.
3. Ceramic tiles are used in RF and microwave packaging, semiconductor and power module packaging, etc.
4. The raw ceramic tile slurry is used in conjunction with our company's raw ceramic tiles for aluminum nitride HTCC, alumina HTCC and LTCC, and is applied in RF and microwave packaging, semiconductor and power module packaging, etc. It has good compatibility with our company's raw ceramic.
5. ZTA ceramic substrates are used in advanced industrial fields such as high-power electric vehicles and high-power LED lamps;
6. Silicon nitride substrates are applied in new energy vehicles, modern transportation tracks and other fields;
7. HTCC products are used for UVLED, RF and microwave packaging, radar module packaging, power module packaging, semiconductor heaters and packaging of high-reliability civilian components.
8. UVLED and VCSEL brackets can be used for the packaging of higher-power chips in the consumer electronics field.
9. The base material products for optical communication modules are mainly used in the communication field (microwave, millimeter-wave communication, optical communication, radio communication), and they are customized products.